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Laminating machines for Printed Circuit Boards:
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Photosensitive Dry-films for PCB production & prototyping:
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Dry Film Photoresist DF940 - Dry-Film Processing

Dry Film Photoresist DF940 are designed to be developed and stripped in aqueous sodium or potassium carbonate.

It offers superior performance and resistance to leaching in all the most commonly used plating baths used in printed circuit manufacturing. It is highly resistant to acid etching processes.

Our Dry Film Photoresist DF940 is extremely flexible, ensuring reliable tenting performance even on large tooling holes, good tenting performance can be achieved with resists of 40 micron and thicker.

The Dry Film Photoresist DF940 has excellent adhesion and definition characteristics producing very high yields on fine line technologies.

Specifications and Processing Guide:
Process Parameter Detail/Notes Range Optimum
Pre-lamination cleaning mechanical cleaning (pumice or brush) or chemical cleaning. A well cleaned board should be able to keep a water film for at least 20-30 seconds.
drying time oven @ 110°C±5°C 15 - 20 min. 15 min.
Lamination temperature InGraph Hot Roll Dry-film Laminator 105 - 125°C
(221 - 257°F)
110°C
(230°F)
pressure 2.5 - 3.5 Bar
(35 - 50 Psi)
3.0 Bar
(43 Psi)
speed 1 m - 3 m/min
(3 - 9 ft./min)
1.2 m/min(1)
4 ft./min (1)
Post-lamination hold time time Minimum: hold time necessary to allow panels to cool down to room temperature
Maximum: the total hold time between lamination and exposure should not exceed 15 days
to maintain the best tenting performances a maximum hold time of 7 days is recommended.
20 min - 15 days  
Exposure Stouffer Step 21 step, variable neutral density wedge 6 - 9 8
energy UV Lamps with peak emissions at 360 - 380 nm 35 - 100 mJ/cm2 55 mJ/cm2
time UV Source calibrate
each roll
calibrate
each roll
color before exposure - glossy dark green
after exposure - glossy dark blue
Post-exposure hold time time the total hold time between lamination and development should not exceed 3 days 10 min - 3 days 15 min (2)
Development breakpoint the image should appear to be 100% developed to the naked eye 50 - 65% of total dev. time 60% of total dev. time (3)
chemistry anhydrous sodium carbonate - Na2CO3 (weight %) (4)
potassium carbonate - K2CO3 (weight %)
0.80 - 1.20%
0.60 - 1.00%
0.90%
0.80%
temperature Na2CO3

K2CO3
26 - 32°C
(80 - 90°F)
26 - 30°C
(80 - 86°F)
29°C
(85°F)
28°C
(82°F)
pressure spray 1.2 - 1.8 Bar
(17 - 25 Psi)
1.5 Bar
(22 Psi)
time breakpoint 60%, D.F. Load 0.15 m2/l (6 feet2/gal) 35 sec. -
Pre-etch drying time 100°C±5°C - 5 min
Stripping breakpoint   40 - 60% of total dev. time 50% of total dev. time
chemistry sodium hydroxide - NaOH (weight %)
potassium hydroxide - KOH (weight %)
1.5 - 3.5%
2.0 - 4.0%
2.5%
3.0%
temperature   40 - 60°C
(104 - 140°F)
50°C
(122°F)
pressure spray 1.5 - 4.0 Bar
(22 - 58 Psi)
3.0 Bar
(43 Psi)
time NaOH
KOH
95 sec.
110 sec.
-
Proprietary strippers can be used for: Smaller flakes, higher strip speed, reduced copper oxidation and Tin or Tin / Lead attack.

Notes:

  1. With Dry Film Hot-Roll Laminator, the midrange position of the speed control knob (at 12:00) corresponds to a web speed of approximately 1.2 m (4 feet) per minute.
  2. DF940 can be developed immediately after exposure. We have found, however, that for fine line circuit patterns, letting the panel sit for 15 minutes after exposure enhances the adhesion of the thin traces to the underlying copper.
  3. The recommended breakpoint for DF940 is 50% of the way though the developing time. The image has reached "breakpoint" when, to the naked eye, the pattern looks to be fully developed. Visual breakpoints can be very misleading. A more accurate evaluation can be made by carefully running your ungloved fingers over the surface of the panel. If you can feel a distinctly slimy or slippery coating in areas that appear to be free of photopolymer, the image needs more time in the developer.
  4. Two forms of sodium carbonate are commercially available. Both can be used to prepare DF940 developing solution:
    • Soda ash (anhydrous sodium carbonate): Na2CO3
    • Sodium carbonate monohydrate: Na2CO3*H2O
  5. If properly imaged, the dry-film should be tough enough after developing to scrub with a kitchen sponge to remove any residual traces of adhesive or photopolymer from the exposed copper areas. This may be necessary if tray or bubble assisted developing is used. Boards developed with high pressure spraying equipment do not generally need this extra attention.

Storage should be in U.V. free conditions with temperature of 20–25°C (59-68°F) and a relative humidity of 40-70%.

Please use the following order form for placing your order:
Item#Sort up Description Net Price Ent. Qty
DF12-DF940I-030-2 Photoresist - negative acting (0.04 mm (40 micron) -
 304 mm (12") x 30 m (100 ft.)) - 76.2 mm (3") core - 2 ROLL CASE
 229.56€ --
DF12-DF940I-152-2 Photoresist - negative acting (0.04 mm (40 micron) -
 304 mm (12") x 150 m (500 ft.)) - 76.2 mm (3") core - 2 ROLL CASE
 580.81€ --
DF18-DF940I-152-2 Photoresist - negative acting (0.04 mm (40 micron) -
 457 mm (18") x 150 m (500 ft.)) - 76.2 mm (3") core - 2 ROLL CASE
 743.64€ --
DF24-DF940I-152-2 Photoresist - negative acting (0.04 mm (40 micron) -
 600 mm (24") x 150 m (500 ft.)) - 76.2 mm (3") core - 2 ROLL CASE
 978.47€ --
Make your selections using the buttons Minus / Plus and then click the Add to Cart Button. View Cart
Minimum Order value is 50EUR.
The lead time for above items is max. 1-4 weeks. Do not hesitate to ask for specific deliveries.
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