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Index » PCB Online Catalog » Dry-Film Processing PCB » Lamination » Films » DF 8130 Dry Film Soldermask
 

Dry-Film Processing - DF 8130 Dry Film Soldermask

Specifications and Processing Guide:
Process Parameter Detail/Notes Range Optimum
Pre-lamination drying time oven @ 110°C±5°C 15 - 20 min. 15 min.
Lamination temperature Dry-film Laminator 115°C±5°C 110°C
speed 0.9 m - 1.9 m/min
(3 - 6 ft./min)
1.2 m/min(1)
4 ft./min. (1)
Exposure Stouffer Step 21 step, variable neutral density wedge 10 - 12 11
energy energy density in miliJoules per square centimeter (350 - 420 nm) 150 - 300 mJ/cm2 -
time Tinker & Tinker UV Source Kit calibrate
each roll
calibrate
each roll
color initial - matte medium green
after exposure - matte green
Post-exposure hold time time the total hold time between lamination and development should not exceed 8 hours 0.5 - 8 hours 30 min.
Development breakpoint the image should appear to be 100% developed to the naked eye 40 - 60% of total dev. time 50% of total dev. time (2)
temperature bubble assisted developers 41°C±2°C 41°C
spray developers 43°C±2°C 43°C
chemistry anhydrous sodium carbonate (soda ash, weight%) (3)
sodium carbonate monohydrate (weight %)
0.80 - 0.90%
0.95 - 1.05%
0.85%
1.0%
Cure(4) exposure UV energy in Joules per square centimeter (350 - 420 nm) 3 - 5 J/cm2 4 J/cm2
bake 145°C±5°C 1 hr.

Notes:

  1. With Dry Film Laminator, the midrange position of the speed control knob (at 12:00) corresponds to a web speed of approximately 4 feet per minute.
  2. The recommended breakpoint for 8130 is 50% of the way though the developing time. The image has reached "breakpoint" when,to the naked eye, the pattern looks to be fully developed. Visual breakpoints can be very misleading. A more accurate evaluation can be made by carefully running your ungloved fingers over the surface of the panel. If you can feel a distinctly slimy or slippery coating in areas that appear to be free of photopolymer, the image needs more time in the developer.
  3. Two forms of sodium carbonate are commercially available. Both can be used to prepare DF 8130 developing solution:
    • Soda ash (anhydrous sodium carbonate): Na2CO3
    • Sodium carbonate monohydrate: Na2CO3*H2O
  4. During the final curing step, the board must be baked first and then exposed to the UV source until the prescribed exposure is attained. Exposure can be measured by an International Light A 309 Lightbug. If you do not have a light meter, you can simply expose the baked board to your imaging source for 10 to 12 times as long as your imaging exposure.
  5. If properly imaged, the dry-film should be tough enough after developing to scrub with a kitchen sponge to remove any residual traces of adhesive or photopolymer from the exposed copper areas. This may be necessary if tray or bubble assisted developing is used. Boards developed with high pressure spraying equipment do not generally need this extra attention.
Please use the following order form for placing your order:
Item# Description Net Price Ent. Qty
DF12-8130-005 Soldermask - 0.075 mm (75 micron) thick (305 mm (12") x 5 m (16 ft.)) aqueous process -
 76.2 mm (3") core - for use on etched circuit features - 2 ROLL CASE
 208.49€
DF12-8130-025 Soldermask - 0.075 mm (75 micron) thick (305 mm (12") x 25 m (80 ft.)) aqueous process -
 76.2 mm (3") core - for use on etched circuit features - 2 ROLL CASE
 577.18€
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The lead time for above items is max. 1-4 weeks. We keep you informed. Do not hesitate to ask for specific deliveries. Minimum Order value is 150EUR.
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