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Index » PCB Processing Manual » PCB Substrates » Selection and Preparation
 

Selection and Preparation - Copperclad Substrates

Overview

Dielectric substrates that have been clad with copper foil are one of the basic "raw materials" of the electronics industry. Originally made of phenolic, they are now available in a variety ofmaterials, and thicknesses. Selecting the right "copperclad" depends on theelectrical, thermal, and mechanical characteristics that your application demands. Although there are some pretty exotic combinations to chose from, the vast majority ofcircuit designs can be tested and tweaked using substrates based on a glass/epoxycomposite known as FR-4. InGraph offers a selection of substrates, cleaning supplies, and entry/backing materials.

Formatting

Preparing substrates for drilling and through-hole activation.

Cleaning

Cleaning and activating copper foils.

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