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Index » PCB Processing Manual » Photoresist and Soldermask » Lamination » Pouch Lamination » Peeling Back the Release Liner
 
Photoresist Lamination - Peeling Back the Release Liner
peel off the release liner Attach two pieces of ScotchR tape on opposite sides of one corner of the photopolymer. Using a quick pull, break the dull, matte release liner away from the adhesive side of the photopolymer (photoresist or soldermask).

Peel back 1" of the release liner along one edge to expose the adhesive side of the photopolymer.

Luckily the cover sheet sticks to the photopolymer far better than the peel sheet, so it is just about guaranteed that pulling the pieces of tape apart will strip the peel sheet as desired. If the shiny Mylar cover peels away instead, move to another corner and try again.

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